◆Electrolyticplatingpowersupplydescription:
1.Smallsize,lightweight,highefficiency
Usingauniqueassemblystructuremethod,thereasonableapplicationofnanotechnologymakesTheproductisminiaturizedandlightweight,whichnotonlysavesspacebutalsoimprovesefficiency.
2.High-frequencypulsecurrentoutput
Suitablefornon-ferrousmetalsandalloyplatingprocessrequirements,strongpenetration,goodadhesion,caneffectivelyimprovethedepositionspeedofthecoating.
3.Flexibleuse,simpleoperation
Theoutputvoltageandcurrentcanbeadjustedarbitrarily.Stableandstablecurrent,flexibleconversion.Itcanbeflexiblysetaccordingtotherequirementsoftheelectroplatingprocess.
4.Completeprotectionfunctions
Withinputundervoltage,overvoltage,phaselossprotection,outputovercurrent,overheatingandmanyotherprotectionfunctions,theproductisstableandreliable,andtheinternalstructureadoptsairductsProcessing,allelectronicvitalitypartsaresealed.Reducetheinfluenceoftheexternalenvironmentonthevitalitypartsoftheequipment.
5.Strongexpandablefunction
Timecontrolfunctioncommunicationfunction(4-20mA,0-5V,0-10Vstandardcontrolsignalinterfacecanbeadded).
Softstartfunction,currenttotalizingfunction(Amperehour).
6.Completemodels
Theoutputspecifications(outputvoltage.outputcurrent)areoptional.
Optionalfunctioncontrolmodeisoptional.
◆Electrolyticplatingpowersupplyuse:
Suitableforplatingacidcopper,alkalinecopper,nickel,zinc,lead.Electroplatingoccasionssuchaselectrolyticoilremoval.
◆Electrolyticplatingpowersupplyparameters:
Electrolyticplatingpowersupply